AMD XCVM1402-2HSINSVF1369

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AMD Versal™ Prime XCVM1402-2HSINSVF1369 FPGA

High-performance adaptive compute acceleration platform (ACAP) combining dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors with 1.2M logic cells. Engineered for aerospace, automotive, industrial, and telecommunications applications requiring advanced processing capabilities and long-term availability.

Key Features

  • Dual-core ARM Cortex-A72 MPCore with CoreSight running at 1.65GHz for high-performance computing
  • Dual ARM Cortex-R5F with CoreSight at 800MHz for real-time control
  • 1.2M Logic Cells providing extensive FPGA fabric for custom logic implementation
  • Industrial temperature range: -40°C to 100°C (TJ) for harsh environments
  • Comprehensive connectivity: PCIe, Ethernet, CANbus, USB OTG, DDR, and more
  • 1369-BFBGA package (35x35mm) optimized for high-density designs

Applications

Ideal for advanced embedded systems, software-defined platforms, AI/ML acceleration, 5G infrastructure, ADAS automotive systems, and mission-critical aerospace applications.

Authenticity & Support

Sourced directly from authorized AMD distributors with full manufacturer documentation, traceability certificates, and long lifecycle commitment. RoHS compliant.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ Prime
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz, 1.65GHz
Primary Attributes Versal™ Prime FPGA, 1.2M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1369-BFBGA
Supplier Device Package 1369-BGA (35x35)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY