AMD XCVM1402-2LLEVSVD1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 37,998.05 | Dhs. 37,998.05 |
| 15+ | Dhs. 36,798.10 | Dhs. 551,971.50 |
| 25+ | Dhs. 35,998.14 | Dhs. 899,953.50 |
| 50+ | Dhs. 33,998.24 | Dhs. 1,699,912.00 |
| 100+ | Dhs. 29,998.45 | Dhs. 2,999,845.00 |
| N+ | Dhs. 5,999.69 | Price Inquiry |
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AMD Versal™ Prime XCVM1402-2LLEVSVD1760 FPGA – High-Performance Adaptive Compute Acceleration Platform
The AMD XCVM1402-2LLEVSVD1760 is a cutting-edge Versal™ Prime adaptive compute acceleration platform (ACAP) engineered for mission-critical applications in aerospace, automotive, industrial automation, and 5G wireless infrastructure. Featuring 1.2 million logic cells in a compact 1760-ball FCBGA package, this advanced FPGA combines dual ARM® Cortex®-A72 MPCore™ processors (1.08GHz) with dual ARM® Cortex™-R5F cores (450MHz), delivering exceptional processing power and adaptive hardware acceleration for the most demanding embedded computing workloads.
Why Choose the XCVM1402-2LLEVSVD1760?
- Hybrid MPU + FPGA Architecture: Combines 1.2M logic cells with integrated ARM processing for unmatched flexibility and performance
- Dual-Core Processing Power: ARM Cortex-A72 (1.08GHz) for application processing + ARM Cortex-R5F (450MHz) for real-time control with CoreSight™ debug support
- Comprehensive Connectivity: Full suite of industrial interfaces including DDR memory, PCIe Gen4, Gigabit Ethernet, CANbus, USB OTG, SPI, I2C, UART/USART, and MMC/SD/SDIO
- Industrial-Grade Reliability: 0°C to 100°C junction temperature rating ensures stable operation in harsh environments
- High-Density Integration: 1760-FCBGA package (40mm × 40mm) maximizes I/O density while minimizing board footprint
- Production-Ready: Active production status with full manufacturer documentation, RoHS compliant, backed by authorized distributor stock and long lifecycle commitment
Target Applications
The XCVM1402-2LLEVSVD1760 excels in applications requiring adaptive hardware acceleration combined with integrated ARM processing:
- Edge Computing & AI Inference: Real-time machine learning acceleration at the network edge
- Embedded Vision Systems: High-throughput image processing with programmable acceleration
- 5G Wireless Infrastructure: Baseband processing, beamforming, and protocol acceleration
- Automotive ADAS: Sensor fusion, object detection, and autonomous driving compute platforms
- Industrial Automation: Motion control, machine vision, and deterministic real-time processing
- Aerospace & Defense: Radar processing, software-defined radio, and secure communications
- High-Performance Data Processing: Custom compute acceleration for scientific and financial workloads
Sourcing Confidence
All units are sourced through authorized distribution channels with full manufacturer traceability, comprehensive datasheets, reference designs, and application notes. Our commitment to authenticity and quality ensures you receive genuine AMD Versal Prime devices with complete technical support and long-term availability for production designs.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 450MHz, 1.08GHz |
| Primary Attributes | Versal™ Prime FPGA, 1.2M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| ROHS |  |
XCVM1402-2LLEVSVD1760.pdf