AMD XCVM1802-1LLIVSVA2197

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AMD Versal™ Prime XCVM1802-1LLIVSVA2197 FPGA

The AMD XCVM1802-1LLIVSVA2197 is a high-performance Versal Prime series FPGA featuring 1.9 million logic cells and advanced processing capabilities. This system-on-chip (SoC) integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors, delivering exceptional computational power for aerospace, automotive, industrial, and telecommunications applications.

Key Features

  • 1.9M Logic Cells - Extensive programmable logic resources for complex designs
  • Dual ARM Cortex-A72 MPCore (1GHz) - High-performance application processing
  • Dual ARM Cortex-R5F (400MHz) - Real-time processing capabilities
  • 256KB RAM - Integrated memory for efficient data handling
  • Advanced Connectivity - PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART
  • Industrial Temperature Range - Operates from -40°C to 100°C (TJ)
  • 2197-FCBGA Package - 45x45mm fine-pitch ball grid array

Applications

Ideal for high-density FPGA solutions in aerospace systems, automotive electronics, industrial automation, 5G telecommunications infrastructure, and advanced embedded computing platforms requiring long lifecycle support and authentic sourcing with full manufacturer documentation.

Product Specifications

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ Prime
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ Prime FPGA, 1.9M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)
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