AMD XCVM1802-1LLIVSVD1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 56,787.99 | Dhs. 56,787.99 |
| 15+ | Dhs. 54,994.67 | Dhs. 824,920.05 |
| 25+ | Dhs. 53,799.13 | Dhs. 1,344,978.25 |
| 50+ | Dhs. 50,810.29 | Dhs. 2,540,514.50 |
| 100+ | Dhs. 44,832.61 | Dhs. 4,483,261.00 |
| N+ | Dhs. 8,966.52 | Price Inquiry |
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AMD Versal™ Prime XCVM1802-1LLIVSVD1760 FPGA
The XCVM1802-1LLIVSVD1760 is a high-performance Versal Prime FPGA from AMD, featuring 1.9 million logic cells and advanced heterogeneous processing capabilities. This industrial-grade device combines dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors with extensive connectivity options, making it ideal for aerospace, automotive, telecommunications, and industrial applications requiring high-density programmable logic and embedded processing.
Key Features:
- 1.9M Logic Cells - Massive programmable logic capacity for complex designs
- Dual-Core Processing - ARM Cortex-A72 (1GHz) + ARM Cortex-R5F (400MHz) with CoreSight debug
- 256KB On-Chip RAM - High-speed embedded memory
- Rich Connectivity - PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I2C, UART
- Industrial Temperature Range - Operates from -40°C to 100°C (TJ)
- 1760-FCBGA Package - 40mm x 40mm fine-pitch ball grid array
- Active Production Status - Long lifecycle support with authorized distributor stock
Applications:
This Versal Prime FPGA is engineered for demanding applications in aerospace avionics, automotive ADAS systems, 5G telecommunications infrastructure, industrial automation, high-performance computing, and embedded vision processing where FPGA flexibility meets MPU processing power.
Sourcing Guarantee: All units are sourced from authorized AMD distributors with full manufacturer documentation, traceability, and long lifecycle support. RoHS compliant.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ Prime FPGA, 1.9M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| ROHS |  |
XCVM1802-1LLIVSVD1760.pdf