AMD XCVM1802-1LSIVFVC1760
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 45,637.43 | Dhs. 45,637.43 |
| 15+ | Dhs. 44,196.23 | Dhs. 662,943.45 |
| 25+ | Dhs. 43,235.44 | Dhs. 1,080,886.00 |
| 50+ | Dhs. 40,833.47 | Dhs. 2,041,673.50 |
| 100+ | Dhs. 36,029.54 | Dhs. 3,602,954.00 |
| N+ | Dhs. 7,205.91 | Price Inquiry |
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AMD Versal™ Prime XCVM1802-1LSIVFVC1760 FPGA - High-Performance Adaptive SoC
The AMD Versal Prime XCVM1802-1LSIVFVC1760 is a cutting-edge adaptive System-on-Chip (SoC) combining FPGA fabric with embedded processing cores, delivering exceptional performance for demanding applications in aerospace, automotive, industrial automation, telecommunications, and medical systems.
Key Features & Benefits:
- 1.9M Logic Cells - Massive programmable logic capacity for complex designs
- Dual ARM Cortex-A72 MPCore (1GHz) - High-performance application processing with CoreSight debug
- Dual ARM Cortex-R5F (400MHz) - Real-time processing for safety-critical functions
- 256KB On-Chip RAM - Fast embedded memory for data-intensive operations
- Rich Connectivity - PCIe, Ethernet, USB OTG, CANbus, SPI, I2C, UART, MMC/SD/SDIO interfaces
- Industrial Temperature Range - Operates reliably from -40°C to 100°C (TJ)
- 1760-FCBGA Package (40x40mm) - High-density ball grid array for advanced board designs
- RoHS Compliant - Meets environmental and regulatory standards
Applications:
Ideal for advanced driver assistance systems (ADAS), 5G wireless infrastructure, industrial machine vision, medical imaging equipment, aerospace avionics, high-speed data acquisition, and AI/ML edge computing.
Why Choose This Component:
As an authorized distributor, we guarantee 100% authentic AMD components with full traceability, original manufacturer documentation, and long lifecycle support. Every unit ships with RoHS/REACH compliance certification and is backed by our quality assurance program.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Versal™ Prime |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ Prime FPGA, 1.9M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| ROHS |  |
XCVM1802-1LSIVFVC1760.pdf