AMD XCVM1802-1MSIVSVD1760

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AMD Versal™ Prime XCVM1802-1MSIVSVD1760 FPGA

The XCVM1802-1MSIVSVD1760 is a high-performance adaptive compute acceleration platform (ACAP) from AMD's Versal™ Prime series, combining FPGA fabric with embedded processing for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.

Key Features

  • 1.9M Logic Cells – Massive programmable logic capacity for complex designs
  • Dual ARM® Cortex®-A72 MPCore™ (1.3GHz) + Dual ARM® Cortex™-R5F (600MHz) – Heterogeneous processing with CoreSight™ debug
  • 256KB RAM with DDR, DMA, and PCIe peripherals
  • Rich Connectivity – CANbus, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Industrial Temperature Range – Operates reliably from -40°C to 100°C (TJ)
  • 1760-FCBGA Package (40x40mm) – High-density ball grid array for advanced board designs
  • RoHS Compliant – Meets environmental and regulatory standards

Applications

Ideal for high-reliability systems requiring long lifecycle support: embedded vision, 5G infrastructure, radar/lidar processing, motor control, test & measurement, and software-defined radio.

Full Technical Specifications

Authorized Distributor – Full traceability, original manufacturer documentation, and long-term availability guarantee.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ Prime
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ Prime FPGA, 1.9M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY