AMD XCVM1802-2HSIVSVD1760

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AMD Versal™ Prime XCVM1802-2HSIVSVD1760 FPGA

High-performance adaptive compute acceleration platform (ACAP) featuring 1.9 million logic cells with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors. Engineered for demanding aerospace, automotive, industrial, and telecommunications applications requiring exceptional processing power and reliability.

Key Features:

  • Advanced Processing: Dual ARM Cortex-A72 @ 1.65GHz + Dual ARM Cortex-R5F @ 800MHz with CoreSight™ debug
  • High Logic Density: 1.9M logic cells for complex FPGA designs
  • Memory: 256KB integrated RAM
  • Rich Connectivity: PCIe, Ethernet, USB OTG, CANbus, DDR, DMA, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environments
  • Package: 1760-FCBGA (40x40mm) for high-density board designs
  • RoHS Compliant: Environmentally responsible manufacturing

Applications:

Ideal for high-performance embedded systems, advanced driver assistance systems (ADAS), 5G infrastructure, industrial automation, aerospace avionics, and edge AI acceleration.

Authenticity Guaranteed:

Sourced from authorized AMD distributors with full manufacturer documentation and traceability. Each unit ships with complete datasheets and compliance certificates.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ Prime
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz, 1.65GHz
Primary Attributes Versal™ Prime FPGA, 1.9M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY