AMD XCVM1802-2LLEVSVD1760

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AMD Versal™ Prime XCVM1802-2LLEVSVD1760 FPGA

High-performance adaptive compute acceleration platform (ACAP) featuring 1.9 million logic cells with dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processors. Engineered for aerospace, automotive, industrial automation, and telecommunications applications requiring advanced processing capabilities and long-term availability.

Key Features

  • 1.9M Logic Cells – Versal™ Prime architecture for complex FPGA designs
  • Dual-Core Processing – ARM® Cortex®-A72 MPCore™ (1.08GHz) + ARM® Cortex™-R5F (450MHz) with CoreSight™
  • 256KB On-Chip RAM – High-speed embedded memory
  • Advanced Connectivity – PCIe, DDR, Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART
  • Industrial Temperature Range – 0°C to 100°C (TJ) for demanding environments
  • 1760-FCBGA Package – 40x40mm fine-pitch ball grid array
  • Active Production Status – Long lifecycle commitment from AMD

Applications

Ideal for high-bandwidth data processing, real-time control systems, edge AI acceleration, 5G infrastructure, ADAS automotive systems, and mission-critical aerospace applications.

Quality Assurance

All units sourced from authorized AMD distributors with full manufacturer documentation, traceability certificates, and RoHS compliance. Factory-sealed tray packaging ensures authenticity and reliability.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ Prime
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 450MHz, 1.08GHz
Primary Attributes Versal™ Prime FPGA, 1.9M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY