AMD XCVM1802-2LSEVSVD1760

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AMD Versal™ Prime XCVM1802-2LSEVSVD1760 FPGA SoC

The XCVM1802-2LSEVSVD1760 is a high-performance System-on-Chip (SoC) from AMD's Versal™ Prime series, combining adaptive FPGA fabric with embedded processing cores. This device features 1.9 million logic cells and dual ARM® Cortex®-A72 MPCore™ processors running at 1.08GHz, plus dual ARM® Cortex™-R5F real-time processors at 450MHz, making it ideal for demanding industrial, automotive, aerospace, and communications applications.

Key Features:

  • 1.9M logic cells for complex FPGA designs
  • Dual ARM Cortex-A72 application processors (1.08GHz) with CoreSight™ debug
  • Dual ARM Cortex-R5F real-time processors (450MHz) with CoreSight™
  • 256KB integrated RAM
  • Comprehensive connectivity: PCIe, Ethernet, USB OTG, CANbus, I2C, SPI, UART, MMC/SD/SDIO
  • DDR memory interface and DMA support
  • Industrial temperature range: 0°C to 100°C (TJ)
  • 1760-pin FCBGA package (40x40mm)
  • RoHS compliant

This versatile SoC is perfect for edge computing, embedded vision, industrial automation, 5G infrastructure, and advanced driver assistance systems (ADAS) where both programmable logic and high-performance processing are required.

Product attributes Property Value
Manufacturer AMD
Product Series Versal™ Prime
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 450MHz, 1.08GHz
Primary Attributes Versal™ Prime FPGA, 1.9M Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY