AMD XCVU29P-3FSGA2577E

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Product attributes Property Value
Manufacturer AMD
Product Series Virtex® UltraScale+™
Packaging Tray | Tray
Number of LABs/CLBs 216000
Number of Logic Elements/Cells 3780000
Total RAM Bits 99090432
Number of I/O 448
Number of Gates -
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2577-BBGA, FCBGA
Supplier Device Package 2577-FCBGA (52.5x52.5)

AMD Virtex UltraScale+ FPGA - XCVU29P-3FSGA2577E

The XCVU29P-3FSGA2577E is a high-performance FPGA from AMD's Virtex® UltraScale+™ family, designed for demanding applications in data centers, artificial intelligence, machine learning, high-speed networking, and advanced signal processing.

Key Features:

  • 3.78 Million Logic Cells - Massive programmable logic capacity for complex designs
  • 99Mb Total RAM - Extensive on-chip memory for data-intensive applications
  • 216,000 CLBs - Configurable Logic Blocks for flexible hardware implementation
  • 448 I/O Pins - High-density connectivity for multi-interface systems
  • Surface Mount FCBGA Package - 2577-pin fine-pitch BGA (52.5x52.5mm) for advanced PCB designs
  • Industrial Temperature Range - Operates reliably from 0°C to 100°C (TJ)
  • Low Voltage Operation - 0.825V to 0.876V supply for power efficiency

Ideal Applications:

  • Data center acceleration and cloud computing
  • AI/ML inference and training hardware
  • High-frequency trading systems
  • 5G wireless infrastructure
  • Video processing and transcoding
  • Aerospace and defense systems
  • High-performance computing (HPC)

Technical Specifications:

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