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XCVU57P-L2FSVK2892E

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AMD Virtex® UltraScale+™ FPGA - XCVU57P-L2FSVK2892E

The AMD XCVU57P-L2FSVK2892E is a high-performance FPGA from the Virtex® UltraScale+™ family, engineered for demanding applications requiring exceptional processing power and flexibility. With nearly 3 million logic cells and over 74Mb of embedded RAM, this FPGA delivers the computational density needed for advanced signal processing, AI/ML acceleration, and high-speed networking.

Key Features & Benefits

  • Massive Logic Capacity: 2,851,800 logic elements across 162,960 CLBs provide unparalleled programmable resources
  • High Memory Bandwidth: 74.3Mb total RAM bits enable efficient data buffering and processing
  • Extensive I/O: 624 I/O pins support complex interfacing requirements
  • Low Power Operation: 0.698V-0.742V supply voltage optimizes power efficiency
  • Industrial Temperature Range: Operates reliably from 0°C to 110°C (junction temperature)
  • Compact High-Density Package: 2892-FCBGA (55x55mm) surface mount package

Ideal Applications

Perfect for aerospace & defense systems, 5G wireless infrastructure, data center acceleration, high-performance computing, machine learning inference, video processing & transcoding, and test & measurement equipment.

Why Choose This FPGA?

The Virtex UltraScale+ architecture combines cutting-edge 16nm FinFET+ technology with AMD's proven FPGA design expertise. Whether you're building next-generation communication systems or accelerating complex algorithms, this device provides the performance headroom and flexibility your project demands.

Documentation: Full datasheets and design resources available from AMD.

Specification Value
Manufacturer AMD
Product Series Virtex® UltraScale+™
Part Number XCVU57P-L2FSVK2892E
Packaging Tray
Number of CLBs 162,960
Logic Elements/Cells 2,851,800
Total RAM Bits 74,344,038
Number of I/O 624
Supply Voltage 0.698V ~ 0.742V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 110°C (TJ)
Package Type 2892-BBGA, FCBGA
Package Dimensions 2892-FCBGA (55x55mm)

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