AMD XCVU57P-L2FSVK2892E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | $137,757.13 | $137,757.13 |
| 15+ | $133,406.90 | $2,001,103.50 |
| 25+ | $130,506.75 | $3,262,668.75 |
| 50+ | $123,256.38 | $6,162,819.00 |
| 100+ | $108,755.63 | $10,875,563.00 |
| N+ | $21,751.13 | Price Inquiry |
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| Specification | Value |
|---|---|
| Manufacturer | AMD |
| Product Series | Virtex® UltraScale+™ |
| Part Number | XCVU57P-L2FSVK2892E |
| Packaging | Tray |
| Number of CLBs | 162,960 |
| Logic Elements/Cells | 2,851,800 |
| Total RAM Bits | 74,344,038 |
| Number of I/O | 624 |
| Supply Voltage | 0.698V ~ 0.742V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 110°C (TJ) |
| Package Type | 2892-BBGA, FCBGA |
| Package Dimensions | 2892-FCBGA (55x55mm) |
AMD Virtex® UltraScale+™ FPGA - XCVU57P-L2FSVK2892E
The AMD XCVU57P-L2FSVK2892E is a high-performance FPGA from the Virtex® UltraScale+™ family, engineered for demanding applications requiring exceptional processing power and flexibility. With nearly 3 million logic cells and over 74Mb of embedded RAM, this FPGA delivers the computational density needed for advanced signal processing, AI/ML acceleration, and high-speed networking.
Key Features & Benefits
- Massive Logic Capacity: 2,851,800 logic elements across 162,960 CLBs provide unparalleled programmable resources
- High Memory Bandwidth: 74.3Mb total RAM bits enable efficient data buffering and processing
- Extensive I/O: 624 I/O pins support complex interfacing requirements
- Low Power Operation: 0.698V-0.742V supply voltage optimizes power efficiency
- Industrial Temperature Range: Operates reliably from 0°C to 110°C (junction temperature)
- Compact High-Density Package: 2892-FCBGA (55x55mm) surface mount package
Ideal Applications
Perfect for aerospace & defense systems, 5G wireless infrastructure, data center acceleration, high-performance computing, machine learning inference, video processing & transcoding, and test & measurement equipment.
Why Choose This FPGA?
The Virtex UltraScale+ architecture combines cutting-edge 16nm FinFET+ technology with AMD's proven FPGA design expertise. Whether you're building next-generation communication systems or accelerating complex algorithms, this device provides the performance headroom and flexibility your project demands.
Documentation: Full datasheets and design resources available from AMD.
XCVU57P-L2FSVK2892E.pdf