-
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XCZU11EG-1FFVC1760I
Regular price
Dhs. 23,005.55
Regular price
Dhs. 24,216.38
Sale price
Dhs. 23,005.55
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 23,005.55 AED | Dhs. 23,005.55 AED |
| 15+ | Dhs. 22,279.07 AED | Dhs. 334,186.05 AED |
| 25+ | Dhs. 21,794.74 AED | Dhs. 544,868.50 AED |
| 50+ | Dhs. 20,583.92 AED | Dhs. 1,029,196.00 AED |
| 100+ | Dhs. 18,162.29 AED | Dhs. 1,816,229.00 AED |
| N+ | Dhs. 3,632.46 AED | Price Inquiry |
Shipping calculated at checkout.
Quantity
Couldn't load pickup availability
Recycling Electronic Components
AMD XCZU11EG-1FFVC1760I - Zynq® UltraScale+™ MPSoC EG FPGA
The XCZU11EG-1FFVC1760I is a high-performance System-on-Chip (SoC) combining FPGA fabric with embedded processing, designed for demanding aerospace, automotive, industrial, medical, and telecommunications applications requiring long lifecycle support and full traceability.
Key Features
- Processing Power: Quad ARM® Cortex®-A53 MPCore™ (1.2GHz) + Dual ARM® Cortex™-R5 + ARM Mali™-400 MP2 GPU
- FPGA Fabric: 653K+ programmable logic cells for custom acceleration and I/O flexibility
- Memory: 256KB integrated RAM
- Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI
- Industrial Grade: -40°C to 100°C (TJ) operating temperature range
- Compliance: RoHS/REACH compliant, active lifecycle status
- Package: 1760-FCBGA (42.5mm × 42.5mm)
Applications
Ideal for embedded vision, motor control, industrial automation, 5G wireless infrastructure, advanced driver assistance systems (ADAS), medical imaging, and aerospace/defense systems requiring deterministic real-time processing with FPGA acceleration.
Authorized Distributor: We provide genuine AMD components with full manufacturer traceability, original documentation, and long-term availability commitment for design-in confidence.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| ROHS |  |
XCZU11EG-1FFVC1760I.pdf
×