XCZU11EG-2FFVC1156I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 23,465.18 AED | Dhs. 23,465.18 AED |
| 15+ | Dhs. 22,724.17 AED | Dhs. 340,862.55 AED |
| 25+ | Dhs. 22,230.17 AED | Dhs. 555,754.25 AED |
| 50+ | Dhs. 20,995.16 AED | Dhs. 1,049,758.00 AED |
| 100+ | Dhs. 18,525.14 AED | Dhs. 1,852,514.00 AED |
| N+ | Dhs. 3,705.03 AED | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC EG - XCZU11EG-2FFVC1156I
The XCZU11EG-2FFVC1156I is a high-performance System-on-Chip (SoC) combining ARM processing cores with FPGA programmable logic, delivering exceptional flexibility for embedded applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features
- Heterogeneous Processing: Quad ARM® Cortex®-A53 MPCore™ (1.3GHz), Dual ARM® Cortex™-R5 (600MHz), and ARM Mali™-400 MP2 GPU with CoreSight™ debug
- Massive FPGA Resources: 653K+ programmable logic cells for custom hardware acceleration
- Industrial-Grade Reliability: Extended operating temperature range -40°C to 100°C (TJ)
- Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
- Compact Package: 1156-FCBGA (35x35mm) for space-constrained designs
- Active Production Status: Long lifecycle commitment for design-in confidence
Applications
Ideal for advanced driver assistance systems (ADAS), industrial vision systems, 5G wireless infrastructure, medical imaging equipment, robotics control, and high-performance embedded computing requiring real-time processing with FPGA acceleration.
Quality & Compliance
Sourced from authorized AMD distribution channels with full traceability. RoHS and REACH compliant. Tray packaging available for production volumes.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |

XCZU11EG-2FFVC1156I.pdf