AMD XCZU11EG-2FFVC1156I

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AMD Zynq® UltraScale+™ MPSoC EG - XCZU11EG-2FFVC1156I

The XCZU11EG-2FFVC1156I is a high-performance System-on-Chip (SoC) combining ARM processing cores with FPGA programmable logic, delivering exceptional flexibility for embedded applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.

Key Features

  • Heterogeneous Processing: Quad ARM® Cortex®-A53 MPCore™ (1.3GHz), Dual ARM® Cortex™-R5 (600MHz), and ARM Mali™-400 MP2 GPU with CoreSight™ debug
  • Massive FPGA Resources: 653K+ programmable logic cells for custom hardware acceleration
  • Industrial-Grade Reliability: Extended operating temperature range -40°C to 100°C (TJ)
  • Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
  • Compact Package: 1156-FCBGA (35x35mm) for space-constrained designs
  • Active Production Status: Long lifecycle commitment for design-in confidence

Applications

Ideal for advanced driver assistance systems (ADAS), industrial vision systems, 5G wireless infrastructure, medical imaging equipment, robotics control, and high-performance embedded computing requiring real-time processing with FPGA acceleration.

Quality & Compliance

Sourced from authorized AMD distribution channels with full traceability. RoHS and REACH compliant. Tray packaging available for production volumes.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC EG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)