AMD XCZU11EG-2FFVC1760E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 25,767.52 | Dhs. 25,767.52 |
| 15+ | Dhs. 24,953.81 | Dhs. 374,307.15 |
| 25+ | Dhs. 24,411.34 | Dhs. 610,283.50 |
| 50+ | Dhs. 23,055.15 | Dhs. 1,152,757.50 |
| 100+ | Dhs. 20,342.78 | Dhs. 2,034,278.00 |
| N+ | Dhs. 4,068.56 | Price Inquiry |
Request Quote / Inquiry
AMD Zynq® UltraScale+™ MPSoC EG - XCZU11EG-2FFVC1760E
The XCZU11EG-2FFVC1760E is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC EG series, combining advanced processing capabilities with FPGA flexibility. This device integrates a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2 graphics processing unit, delivering exceptional computational power for demanding embedded applications.
Key Features & Benefits
- Powerful Multi-Core Processing: Quad ARM Cortex-A53 running at 1.3GHz plus dual Cortex-R5 at 533MHz/600MHz for real-time control
- Massive FPGA Logic: 653K+ logic cells enable complex custom hardware acceleration and parallel processing
- Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO for versatile system integration
- Industrial-Grade Reliability: Operating temperature range 0°C to 100°C (TJ), active production status with long lifecycle commitment
- Comprehensive Memory: 256KB on-chip RAM with DMA and watchdog timer peripherals
- RoHS Compliant: Meets environmental and regulatory standards for global deployment
Ideal Applications
Perfect for aerospace, automotive, industrial automation, medical devices, telecommunications infrastructure, and high-performance embedded systems requiring both processing power and hardware programmability.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| ROHS |

XCZU11EG-2FFVC1760E.pdf