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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XCZU17EG-2FFVC1760E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 29,145.76 AED | Dhs. 29,145.76 AED |
| 15+ | Dhs. 28,225.37 AED | Dhs. 423,380.55 AED |
| 25+ | Dhs. 27,611.78 AED | Dhs. 690,294.50 AED |
| 50+ | Dhs. 26,077.79 AED | Dhs. 1,303,889.50 AED |
| 100+ | Dhs. 23,009.81 AED | Dhs. 2,300,981.00 AED |
| N+ | Dhs. 4,601.96 AED | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC EG - XCZU17EG-2FFVC1760E
The AMD XCZU17EG-2FFVC1760E is a high-performance System-on-Chip (SoC) combining advanced processing capabilities with programmable logic, delivering exceptional flexibility for demanding embedded applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features & Benefits
- Heterogeneous Multi-Core Processing: Quad ARM® Cortex®-A53 MPCore™ (up to 1.3GHz) + Dual ARM® Cortex™-R5 for real-time control + ARM Mali™-400 MP2 GPU for graphics acceleration
- Massive Programmable Logic: 926K+ logic cells enable complex FPGA designs and custom hardware acceleration
- Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces for versatile system integration
- Industrial-Grade Reliability: Operating temperature range 0°C to 100°C (TJ), RoHS compliant
- High-Density Package: 1760-FCBGA (42.5mm × 42.5mm) for space-constrained designs
- Active Production Status: Full traceability and long lifecycle availability from authorized distributors
Ideal Applications
Perfect for advanced driver assistance systems (ADAS), industrial vision systems, 5G wireless infrastructure, medical imaging equipment, aerospace avionics, and high-performance embedded computing platforms requiring both processing power and FPGA flexibility.
Technical Documentation & Design Support
Complete datasheets, reference designs, development tools, and technical support available to accelerate your design-in process and ensure successful product deployment.
Complete Product Specifications
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| ROHS |  |
XCZU17EG-2FFVC1760E.pdf