XCZU17EG-2FFVD1760E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 32,306.15 AED | Dhs. 32,306.15 AED |
| 15+ | Dhs. 31,285.93 AED | Dhs. 469,288.95 AED |
| 25+ | Dhs. 30,605.81 AED | Dhs. 765,145.25 AED |
| 50+ | Dhs. 28,905.48 AED | Dhs. 1,445,274.00 AED |
| 100+ | Dhs. 25,504.84 AED | Dhs. 2,550,484.00 AED |
| N+ | Dhs. 5,100.97 AED | Price Inquiry |
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AMD XCZU17EG-2FFVD1760E Zynq UltraScale+ MPSoC EG
The XCZU17EG-2FFVD1760E is a high-performance System-on-Chip (SoC) combining programmable logic with processing power, ideal for aerospace, automotive, industrial automation, and telecommunications applications requiring advanced signal processing and real-time control.
Key Features
- 926K+ Logic Cells - Extensive FPGA fabric for complex designs
- Quad ARM Cortex-A53 MPCore with CoreSight at 1.3GHz - High-performance application processing
- Dual ARM Cortex-R5 with CoreSight at 600MHz - Real-time processing capabilities
- ARM Mali-400 MP2 GPU - Graphics and display processing
- 256KB On-Chip RAM - Fast embedded memory
- Rich Connectivity - CANbus, Ethernet, USB OTG, I2C, SPI, UART, MMC/SD/SDIO
- 1760-FCBGA Package (42.5x42.5mm) - High-density integration
- Industrial Temperature Range - 0°C to 100°C (TJ)
Applications
This device excels in applications requiring heterogeneous processing, including advanced driver assistance systems (ADAS), industrial vision systems, 5G wireless infrastructure, medical imaging, and aerospace/defense systems.
Authenticity & Support
All units are sourced from authorized distributors with full manufacturer documentation, traceability, and long lifecycle commitment. RoHS compliant.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| ROHS |

XCZU17EG-2FFVD1760E.pdf