AMD XCZU17EG-2FFVD1760E

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AMD XCZU17EG-2FFVD1760E Zynq UltraScale+ MPSoC EG

The XCZU17EG-2FFVD1760E is a high-performance System-on-Chip (SoC) combining programmable logic with processing power, ideal for aerospace, automotive, industrial automation, and telecommunications applications requiring advanced signal processing and real-time control.

Key Features

  • 926K+ Logic Cells - Extensive FPGA fabric for complex designs
  • Quad ARM Cortex-A53 MPCore with CoreSight at 1.3GHz - High-performance application processing
  • Dual ARM Cortex-R5 with CoreSight at 600MHz - Real-time processing capabilities
  • ARM Mali-400 MP2 GPU - Graphics and display processing
  • 256KB On-Chip RAM - Fast embedded memory
  • Rich Connectivity - CANbus, Ethernet, USB OTG, I2C, SPI, UART, MMC/SD/SDIO
  • 1760-FCBGA Package (42.5x42.5mm) - High-density integration
  • Industrial Temperature Range - 0°C to 100°C (TJ)

Applications

This device excels in applications requiring heterogeneous processing, including advanced driver assistance systems (ADAS), industrial vision systems, 5G wireless infrastructure, medical imaging, and aerospace/defense systems.

Authenticity & Support

All units are sourced from authorized distributors with full manufacturer documentation, traceability, and long lifecycle commitment. RoHS compliant.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC EG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY