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XCZU17EG-2FFVD1760I
Regular price
Dhs. 36,919.38
Regular price
Dhs. 38,862.51
Sale price
Dhs. 36,919.38
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 36,919.38 AED | Dhs. 36,919.38 AED |
| 15+ | Dhs. 35,753.51 AED | Dhs. 536,302.65 AED |
| 25+ | Dhs. 34,976.26 AED | Dhs. 874,406.50 AED |
| 50+ | Dhs. 33,033.13 AED | Dhs. 1,651,656.50 AED |
| 100+ | Dhs. 29,146.88 AED | Dhs. 2,914,688.00 AED |
| N+ | Dhs. 5,829.38 AED | Price Inquiry |
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Recycling Electronic Components
AMD Zynq® UltraScale+™ MPSoC EG - XCZU17EG-2FFVD1760I
The XCZU17EG-2FFVD1760I is a high-performance System-on-Chip (SoC) combining ARM processing power with advanced FPGA fabric, ideal for demanding embedded applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features:
- Processing Power: Quad ARM® Cortex®-A53 MPCore™ (1.3GHz) + Dual ARM® Cortex™-R5 + ARM Mali™-400 MP2 GPU
- FPGA Fabric: 926K+ programmable logic cells for custom hardware acceleration
- Memory: 256KB integrated RAM
- Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART, MMC/SD/SDIO
- Industrial Grade: Operating temperature -40°C to 100°C (TJ)
- Compliance: RoHS/REACH certified with full traceability
- Package: 1760-FCBGA (42.5x42.5mm) for high-density board integration
Applications:
Perfect for advanced driver assistance systems (ADAS), industrial vision systems, 5G infrastructure, medical imaging equipment, and mission-critical aerospace/defense applications requiring long lifecycle support.
Authorized Distributor: Full manufacturer traceability, original packaging, and long lifecycle commitment. Contact us for volume pricing, lead times, and technical support.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| ROHS |  |
XCZU17EG-2FFVD1760I.pdf
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