XCZU17EG-2FFVE1924I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 33,309.44 AED | Dhs. 33,309.44 AED |
| 15+ | Dhs. 32,257.56 AED | Dhs. 483,863.40 AED |
| 25+ | Dhs. 31,556.31 AED | Dhs. 788,907.75 AED |
| 50+ | Dhs. 29,803.18 AED | Dhs. 1,490,159.00 AED |
| 100+ | Dhs. 26,296.93 AED | Dhs. 2,629,693.00 AED |
| N+ | Dhs. 5,259.39 AED | Price Inquiry |
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AMD XCZU17EG-2FFVE1924I Zynq® UltraScale+™ MPSoC EG
The AMD XCZU17EG-2FFVE1924I is a high-performance System-on-Chip (SoC) combining a feature-rich 64-bit quad-core ARM® Cortex®-A53 MPCore™ processor, dual ARM® Cortex™-R5 real-time processors, ARM Mali™-400 MP2 graphics engine, and programmable logic with over 926,000 logic cells. This Zynq® UltraScale+™ MPSoC delivers exceptional processing power and flexibility for demanding embedded applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features & Benefits
- Multi-core Processing Power: Quad ARM Cortex-A53 at 1.3GHz + Dual Cortex-R5 at 600MHz for real-time control
- Massive FPGA Fabric: 926K+ programmable logic cells for custom acceleration and I/O expansion
- Industrial Temperature Range: -40°C to +100°C (TJ) for harsh environment deployment
- Rich Connectivity: Ethernet, USB OTG, CANbus, PCIe, multiple serial interfaces (UART, SPI, I²C)
- 256KB On-chip RAM: High-speed embedded memory for critical data processing
- RoHS Compliant: Meets environmental and regulatory standards for global markets
- 1924-FCBGA Package: 45mm × 45mm footprint optimized for high-density designs
Typical Applications
- Advanced Driver Assistance Systems (ADAS) and automotive vision processing
- Industrial robotics and machine vision
- 5G wireless infrastructure and software-defined radio
- Medical imaging and diagnostic equipment
- Aerospace and defense embedded systems
- High-performance edge computing and AI inference
Why Choose Our Distribution
As an authorized distributor, we guarantee 100% authentic AMD components with full traceability, manufacturer warranty support, and compliance documentation (RoHS/REACH). All units ship from certified facilities with anti-static packaging and proper handling to ensure product integrity.
Need volume pricing, custom packaging, or technical support? Contact our applications engineering team for design-in assistance and lifecycle management programs.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1924-BBGA, FCBGA |
| Supplier Device Package | 1924-FCBGA (45x45) |
| ROHS |

XCZU17EG-2FFVE1924I.pdf