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XCZU17EG-3FFVB1517E
Regular price
Dhs. 33,834.33
Regular price
Dhs. 35,615.08
Sale price
Dhs. 33,834.33
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 33,834.33 AED | Dhs. 33,834.33 AED |
| 15+ | Dhs. 32,765.87 AED | Dhs. 491,488.05 AED |
| 25+ | Dhs. 32,053.57 AED | Dhs. 801,339.25 AED |
| 50+ | Dhs. 30,272.82 AED | Dhs. 1,513,641.00 AED |
| 100+ | Dhs. 26,711.31 AED | Dhs. 2,671,131.00 AED |
| N+ | Dhs. 5,342.26 AED | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC EG - XCZU17EG-3FFVB1517E
The XCZU17EG-3FFVB1517E is a high-performance System-on-Chip (SoC) combining programmable logic with processing power, delivering exceptional flexibility for embedded applications across aerospace, automotive, industrial, medical, and telecommunications sectors.
Key Features
- 926K+ Logic Cells - Extensive FPGA fabric for complex digital designs
- Quad ARM® Cortex®-A53 MPCore™ - High-performance application processing up to 1.5GHz
- Dual ARM® Cortex™-R5 - Real-time processing with CoreSight™ debug
- ARM Mali™-400 MP2 GPU - Graphics and video processing acceleration
- 256KB On-Chip RAM - Fast embedded memory for critical operations
- Rich Connectivity - CANbus, Ethernet, USB OTG, I2C, SPI, UART, MMC/SD/SDIO interfaces
- 1517-FCBGA Package (40x40mm) - High-density ball grid array for space-constrained designs
- Industrial Temperature Range - 0°C to 100°C junction temperature
- Active Production Status - Long lifecycle commitment for design-in confidence
- RoHS Compliant - Meets environmental and regulatory standards
Applications
Ideal for advanced embedded systems requiring high processing power, programmable logic, and extensive I/O connectivity including industrial automation, automotive ADAS, medical imaging, 5G wireless infrastructure, aerospace avionics, and video processing systems.
Authorized Distributor - Full traceability, original manufacturer documentation, and long-term availability guarantee.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 667MHz, 1.5GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40) |
| ROHS |  |
XCZU17EG-3FFVB1517E.pdf
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