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XCZU17EG-L2FFVC1760E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 33,313.79 AED | Dhs. 33,313.79 AED |
| 15+ | Dhs. 32,261.78 AED | Dhs. 483,926.70 AED |
| 25+ | Dhs. 31,560.44 AED | Dhs. 789,011.00 AED |
| 50+ | Dhs. 29,807.08 AED | Dhs. 1,490,354.00 AED |
| 100+ | Dhs. 26,300.36 AED | Dhs. 2,630,036.00 AED |
| N+ | Dhs. 5,260.07 AED | Price Inquiry |
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AMD XCZU17EG-L2FFVC1760E - Zynq® UltraScale+™ MPSoC EG Series
The XCZU17EG-L2FFVC1760E is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC EG family, combining advanced processing capabilities with extensive FPGA logic resources. This device integrates a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2 GPU, delivering exceptional computational power for demanding embedded applications.
Key Features & Benefits
- 926K+ Logic Cells - Extensive FPGA fabric for complex custom logic implementation
- Multi-Core Processing - Quad Cortex-A53 (1.3GHz) + Dual Cortex-R5 (600MHz) for real-time and application processing
- 256KB On-Chip RAM - High-speed memory for critical operations
- Rich Connectivity - CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
- Industrial Temperature Range - Operates reliably from 0°C to 100°C (TJ)
- RoHS Compliant - Meets environmental and regulatory standards
- Active Part Status - Long-term availability for design-in confidence
Ideal Applications
This MPSoC is perfectly suited for aerospace, automotive ADAS, industrial automation, medical imaging, 5G wireless infrastructure, video processing, machine vision, and high-reliability embedded systems requiring both processing power and programmable logic.
Quality & Compliance
As an authorized distributor, we provide 100% traceable, genuine AMD components with full manufacturer documentation. All units are RoHS and REACH compliant, backed by our quality assurance program and global shipping network.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| ROHS |  |
XCZU17EG-L2FFVC1760E.pdf