AMD XCZU19EG-2FFVC1760I

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AMD Zynq® UltraScale+™ MPSoC EG - XCZU19EG-2FFVC1760I

The XCZU19EG-2FFVC1760I is a high-performance System-on-Chip (SoC) combining ARM processing power with FPGA programmable logic, designed for demanding applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.

Key Features

  • Processing Power: Quad ARM® Cortex®-A53 MPCore™ (1.3GHz) + Dual ARM® Cortex™-R5 with CoreSight™
  • FPGA Fabric: 1143K+ logic cells for maximum design flexibility
  • Memory: 256KB integrated RAM
  • Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Grade: Operating temperature -40°C to 100°C (TJ)
  • Compliance: RoHS/REACH certified with full traceability
  • Package: 1760-FCBGA (42.5x42.5mm) for high-density board designs

Applications

Ideal for advanced embedded systems requiring real-time processing, hardware acceleration, and long lifecycle support including aerospace flight control, automotive ADAS, industrial robotics, medical imaging equipment, and 5G telecommunications infrastructure.

Authorized Distributor: Full manufacturer traceability, original packaging, and long lifecycle commitment. Contact us for volume pricing, lead times, and technical support.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC EG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY