XCZU19EG-L2FFVB1517E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 30,573.70 AED | Dhs. 30,573.70 AED |
| 15+ | Dhs. 29,608.20 AED | Dhs. 444,123.00 AED |
| 25+ | Dhs. 28,964.55 AED | Dhs. 724,113.75 AED |
| 50+ | Dhs. 27,355.41 AED | Dhs. 1,367,770.50 AED |
| 100+ | Dhs. 24,137.12 AED | Dhs. 2,413,712.00 AED |
| N+ | Dhs. 4,827.42 AED | Price Inquiry |
Couldn't load pickup availability
AMD Zynq UltraScale+ MPSoC EG - XCZU19EG-L2FFVB1517E
The AMD XCZU19EG-L2FFVB1517E is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC EG series, combining programmable logic with processing power for demanding embedded applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features & Benefits
- Multi-Core Processing: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2 GPU for versatile computing
- Massive Logic Capacity: 1143K+ logic cells for complex FPGA designs and custom acceleration
- High-Speed Performance: Operating frequencies up to 1.3GHz (processing), 600MHz, and 533MHz across different subsystems
- Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, and EBI/EMI interfaces
- Industrial Temperature Range: 0°C to 100°C (TJ) for reliable operation in harsh environments
- Compact High-Density Package: 1517-FCBGA (40x40mm) for space-constrained designs
- RoHS Compliant: Environmentally friendly and regulation-ready
Applications
Ideal for advanced driver assistance systems (ADAS), industrial machine vision, 5G wireless infrastructure, medical imaging equipment, aerospace avionics, high-performance embedded computing, and real-time signal processing.
Quality & Compliance
Authorized distribution with full manufacturer traceability, active part status, and RoHS/REACH compliance documentation. Long lifecycle commitment ensures availability for multi-year design cycles.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40) |
| ROHS |

XCZU19EG-L2FFVB1517E.pdf