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XCZU2CG-2SBVA484E

Regular price Dhs. 1,392.54
Regular price Dhs. 1,465.81 Sale price Dhs. 1,392.54
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Recycling Electronic Components

AMD Zynq® UltraScale+™ MPSoC CG - XCZU2CG-2SBVA484E

The XCZU2CG-2SBVA484E is a high-performance System-on-Chip (SoC) combining dual ARM® Cortex®-A53 MPCore™ processors running at 1.3GHz with dual ARM® Cortex™-R5 real-time processors, integrated with 103K+ logic cell FPGA fabric. This powerful combination delivers exceptional processing capability for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.

Key Features & Benefits

  • Dual-core ARM Cortex-A53 MPCore™ at 1.3GHz - High-performance application processing with CoreSight™ debug
  • Dual ARM Cortex-R5 at 533MHz - Real-time processing for deterministic control applications
  • 103K+ Logic Cells FPGA - Flexible hardware acceleration and custom logic implementation
  • 256KB On-chip RAM - Fast access memory for critical operations
  • Rich Connectivity - CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
  • Industrial Temperature Range - Operates reliably from 0°C to 100°C (TJ)
  • 484-FCBGA Package (19x19mm) - Compact form factor for space-constrained designs
  • RoHS Compliant - Meets environmental standards for global deployment

Ideal Applications

This versatile MPSoC is engineered for demanding applications requiring both high-performance processing and programmable logic, including advanced driver assistance systems (ADAS), industrial machine vision, medical imaging equipment, 5G wireless infrastructure, aerospace avionics, and embedded vision systems.

Why Choose This Component?

As an authorized distributor, we provide full traceability documentation, RoHS/REACH compliance certificates, and long lifecycle availability support. This component is backed by AMD's comprehensive technical documentation and development tools, ensuring design-in confidence for your critical projects.

Stock Status: Active - Available for immediate shipment
Packaging: Tray packaging for production volumes
Lead Time: Contact us for current availability and delivery schedules

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC CG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 484-BFBGA, FCBGA
Supplier Device Package 484-FCBGA (19x19)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

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