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Product attributes Property Value Manufacturer AMD Product Series Zynq® UltraScale+™ MPSoC CG Packaging Tray | Part Status Active Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Grade - Qualification - Package / Case 625-BFBGA, FCBGA Supplier Device Package 625-FCBGA (21x21)
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Datasheets:
XCZU2CG-L1SFVA625I
.pdf
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