XCZU2EG-1SFVA625I

AMD Zynq UltraScale+ MPSoC EG XCZU2EG-1SFVA625I

The XCZU2EG-1SFVA625I is a high-performance System-on-Chip (SoC) from AMD's Zynq UltraScale+ MPSoC EG series, combining programmable logic with processing power for demanding embedded applications in industrial automation, automotive systems, aerospace, and telecommunications infrastructure.

Why Choose the XCZU2EG-1SFVA625I?

This versatile MPSoC delivers exceptional processing capabilities with its heterogeneous multi-core architecture, enabling you to tackle complex real-time control, signal processing, and application workloads simultaneously. The integrated FPGA fabric provides hardware acceleration and customization flexibility that pure processor solutions cannot match.

Key Features & Benefits

• Quad ARM Cortex-A53 MPCore with CoreSight – High-performance 64-bit application processing up to 1.2GHz for Linux, RTOS, and bare-metal applications
• Dual ARM Cortex-R5 with CoreSight – Dedicated real-time processing cores for deterministic control and safety-critical functions
• ARM Mali-400 MP2 GPU – Hardware graphics acceleration for HMI and visualization applications
• 103K+ Logic Cells – Flexible FPGA fabric for custom IP, hardware acceleration, and I/O expansion
• 256KB On-Chip RAM – Fast scratchpad memory for low-latency data processing
• Industrial Temperature Range – Qualified for -40°C to 100°C (TJ) operation in harsh environments
• RoHS Compliant – Meets environmental and regulatory standards for global deployment
• Active Production Status – Long-term availability ensures design longevity and supply chain stability

Comprehensive Connectivity & Peripherals

The XCZU2EG-1SFVA625I integrates a rich set of hard IP peripherals to minimize FPGA resource usage and accelerate time-to-market:

• Networking: Gigabit Ethernet, CANbus for automotive/industrial protocols
• Storage & Memory: MMC/SD/SDIO interfaces for external storage
• Serial Communications: Multiple UART/USART, SPI, I2C interfaces
• USB: USB OTG for host/device connectivity
• System Support: DMA controllers, watchdog timers, and extensive GPIO

Package & Physical Specifications

Supplied in a compact 625-FCBGA (21x21mm) flip-chip ball grid array package, the XCZU2EG-1SFVA625I offers an excellent balance of I/O density and thermal performance. Tray packaging ensures safe handling during manufacturing and assembly processes.

Ideal Applications

• Industrial automation and motion control systems
• Automotive ADAS and gateway applications
• Aerospace and defense embedded computing
• 5G wireless infrastructure and baseband processing
• Medical imaging and diagnostic equipment
• Machine vision and AI inference at the edge

Documentation & Support

Full datasheets, reference designs, and development tools are available from AMD. The Zynq UltraScale+ ecosystem includes Vivado Design Suite, Vitis unified software platform, and PetaLinux for comprehensive hardware and software development support.

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.