XCZU3CG-L1SFVA625I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 2,336.61 AED | Dhs. 2,336.61 AED |
| 15+ | Dhs. 2,262.80 AED | Dhs. 33,942.00 AED |
| 25+ | Dhs. 2,213.61 AED | Dhs. 55,340.25 AED |
| 50+ | Dhs. 2,090.63 AED | Dhs. 104,531.50 AED |
| 100+ | Dhs. 1,844.68 AED | Dhs. 184,468.00 AED |
| N+ | Dhs. 368.94 AED | Price Inquiry |
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AMD Zynq UltraScale+ MPSoC XCZU3CG-L1SFVA625I
The XCZU3CG-L1SFVA625I is a high-performance System-on-Chip (SoC) combining dual ARM® Cortex®-A53 MPCore™ processors with dual ARM® Cortex™-R5 cores and 154K+ logic cells of programmable FPGA fabric. Engineered for mission-critical applications in aerospace, automotive, industrial automation, and telecommunications infrastructure.
Key Features
- Dual-core ARM Cortex-A53 running at 1.2GHz for application processing
- Dual-core ARM Cortex-R5 at 500MHz for real-time control
- 154K+ logic cells of UltraScale+ FPGA fabric for custom acceleration
- 256KB on-chip RAM for low-latency data processing
- Industrial temperature range: -40°C to +100°C (TJ)
- RoHS compliant for environmental standards
Connectivity & Peripherals
Comprehensive I/O support including CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, plus DMA and watchdog timer peripherals for robust system integration.
Applications
- Aerospace & defense embedded systems
- Automotive ADAS and infotainment platforms
- Industrial automation and motor control
- 5G/telecom infrastructure equipment
- High-reliability edge computing
Documentation: Full datasheets and technical reference manuals available from AMD.
Long-term availability: Active production status ensures reliable supply for multi-year design cycles.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC CG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 625-BFBGA, FCBGA |
| Supplier Device Package | 625-FCBGA (21x21) |
| ROHS |

XCZU3CG-L1SFVA625I.pdf