AMD XCZU3CG-L2SFVA625E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 2,669.66 | Dhs. 2,669.66 |
| 15+ | Dhs. 2,585.34 | Dhs. 38,780.10 |
| 25+ | Dhs. 2,529.14 | Dhs. 63,228.50 |
| 50+ | Dhs. 2,388.63 | Dhs. 119,431.50 |
| 100+ | Dhs. 2,107.61 | Dhs. 210,761.00 |
| N+ | Dhs. 421.52 | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC CG - XCZU3CG-L2SFVA625E
The XCZU3CG-L2SFVA625E is a high-performance System-on-Chip (SoC) combining dual ARM® Cortex®-A53 MPCore™ processors with dual ARM® Cortex™-R5 processors and 154K+ logic cells of FPGA fabric. Engineered for aerospace, automotive, industrial automation, and telecom infrastructure applications requiring real-time processing, programmable logic, and extensive connectivity.
Key Features
- Dual-core ARM Cortex-A53 MPCore running at 1.3GHz with CoreSight™ debug
- Dual-core ARM Cortex-R5 running at 533MHz for real-time control
- 154K+ logic cells of UltraScale+ FPGA fabric for custom acceleration
- 256KB on-chip RAM for low-latency data processing
- Rich connectivity: CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART, MMC/SD/SDIO
- Industrial temperature range: 0°C to 100°C (TJ)
- 625-FCBGA package (21x21mm) for compact integration
- RoHS compliant for environmental compliance
Applications
Ideal for embedded vision systems, motor control, industrial networking, software-defined radio, edge AI inference, and safety-critical automotive systems requiring deterministic real-time performance with FPGA acceleration.
Documentation & Support
Full datasheets, reference designs, and development tools available from AMD. Long-term product availability guaranteed for industrial and aerospace deployments.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC CG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 625-BFBGA, FCBGA |
| Supplier Device Package | 625-FCBGA (21x21) |
| ROHS |  |
XCZU3CG-L2SFVA625E.pdf