AMD XCZU46DR-L2FFVH1760I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 148,485.57 | Dhs. 148,485.57 |
| 15+ | Dhs. 143,796.56 | Dhs. 2,156,948.40 |
| 25+ | Dhs. 140,670.55 | Dhs. 3,516,763.75 |
| 50+ | Dhs. 132,855.52 | Dhs. 6,642,776.00 |
| 100+ | Dhs. 117,225.46 | Dhs. 11,722,546.00 |
| N+ | Dhs. 23,445.09 | Price Inquiry |
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AMD Zynq UltraScale+ RFSoC XCZU46DR-L2FFVH1760I - High-Performance RF System-on-Chip
The AMD XCZU46DR-L2FFVH1760I represents the pinnacle of RF System-on-Chip technology, combining high-performance processing with advanced FPGA capabilities. This cutting-edge component delivers exceptional performance for aerospace, telecommunications, industrial automation, and medical device applications requiring robust, long-lifecycle semiconductor solutions with guaranteed traceability and reliability.
Key Features & Benefits
- Dual Processing Architecture: Quad ARM Cortex-A53 MPCore with CoreSight and Dual ARM Cortex-R5 processors deliver exceptional computational power for demanding real-time applications
- Massive Logic Capacity: 930K+ logic cells provide extensive programmable resources for complex signal processing and custom hardware acceleration
- Industrial-Grade Reliability: Extended operating temperature range (-40°C to 100°C junction temperature) ensures reliable performance in demanding environments including aerospace, defense, and industrial automation
- Comprehensive Connectivity: Integrated CANbus, Ethernet, PCIe, USB OTG, I2C, SPI, UART/USART, and MMC/SD/SDIO interfaces enable seamless system integration
- High-Speed Performance: Dual clock speeds (533MHz and 1.333GHz) optimize power efficiency and processing performance for diverse workloads
- Active Production Status: Guaranteed long-term availability and full traceability for critical applications with extended lifecycle requirements
- 256KB On-Chip RAM: Integrated memory for low-latency data processing and buffering
- Advanced Peripherals: DDR memory controller, DMA engines, and PCIe interface for high-bandwidth data transfer
Target Applications & Use Cases
The XCZU46DR-L2FFVH1760I is engineered for advanced RF and signal processing applications across multiple industries:
- 5G Wireless Infrastructure: Massive MIMO, beamforming, and software-defined radio implementations
- Aerospace & Defense: Radar systems, electronic warfare, secure communications, and avionics
- Test & Measurement: High-speed data acquisition, signal analysis, and protocol testing equipment
- Software-Defined Radio (SDR): Flexible, reconfigurable radio platforms for research and commercial applications
- High-Performance Embedded Computing: Edge AI, machine learning acceleration, and real-time data processing
- Medical Imaging: Ultrasound, MRI signal processing, and diagnostic equipment
- Industrial Automation: Motion control, machine vision, and predictive maintenance systems
Why Choose AMD Zynq UltraScale+ RFSoC?
The Zynq UltraScale+ RFSoC family combines the flexibility of programmable logic with the performance of high-speed processing cores and integrated RF data converters. This unique architecture enables system designers to implement complete RF signal chains on a single chip, reducing board complexity, power consumption, and time-to-market while improving system reliability and performance.
Quality & Compliance
RoHS Compliant - Meets environmental and safety standards for global deployment. Fully traceable with comprehensive documentation for quality assurance and regulatory compliance in aerospace, medical, and industrial applications.
Long-Term Availability & Support
As an authorized distributor, we provide guaranteed long-term availability, full traceability, and comprehensive technical support for the XCZU46DR-L2FFVH1760I. Our value-added services include design-in support, lifecycle management, and obsolescence mitigation strategies to ensure your critical applications remain supported throughout their operational lifetime.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ RFSoC |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.333GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| ROHS |

XCZU46DR-L2FFVH1760I.pdf