AMD XCZU47DR-1FSVE1156E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 56,606.83 | Dhs. 56,606.83 |
| 15+ | Dhs. 54,819.24 | Dhs. 822,288.60 |
| 25+ | Dhs. 53,627.52 | Dhs. 1,340,688.00 |
| 50+ | Dhs. 50,648.21 | Dhs. 2,532,410.50 |
| 100+ | Dhs. 44,689.60 | Dhs. 4,468,960.00 |
| N+ | Dhs. 8,937.92 | Price Inquiry |
Request Quote / Inquiry
AMD XCZU47DR-1FSVE1156E Zynq UltraScale+ RFSoC FPGA
The AMD XCZU47DR-1FSVE1156E is a high-performance Zynq® UltraScale+™ RFSoC (Radio Frequency System-on-Chip) that integrates advanced processing capabilities with programmable logic, making it ideal for demanding applications in wireless communications, aerospace, defense, and high-speed data acquisition systems. This device combines a quad-core ARM® Cortex®-A53 MPCore™ processor with dual ARM® Cortex™-R5 real-time processors, delivering exceptional computational power alongside 930K+ logic cells of FPGA fabric.
Key Features & Benefits
- Integrated RF Data Converters: Eliminates external components, reducing board complexity and power consumption
- High-Performance Processing: Quad-core ARM Cortex-A53 (1.2GHz) + Dual ARM Cortex-R5 (500MHz) processors
- Massive Logic Capacity: 930K+ logic cells for complex FPGA designs
- Industrial Temperature Range: 0°C to 100°C (TJ) for harsh environment reliability
- Comprehensive Connectivity: Ethernet, USB OTG, PCIe, CAN bus, I2C, SPI, UART/USART, MMC/SD/SDIO
- Compact Package: 1156-ball FCBGA (35x35mm) for space-constrained designs
Target Applications
- Software-Defined Radio (SDR) and 5G wireless infrastructure
- Aerospace and defense radar systems
- High-speed test and measurement equipment
- Advanced signal processing and data acquisition
- Mission-critical RF and mixed-signal applications
Designed for mission-critical RF and mixed-signal applications, the XCZU47DR features integrated RF data converters that eliminate the need for external components, reducing board complexity and power consumption. With support for multiple high-speed connectivity interfaces including Ethernet, USB OTG, PCIe, and CAN bus, this RFSoC provides the flexibility and performance required for next-generation software-defined radio, radar systems, test and measurement equipment, and 5G wireless infrastructure. The device operates across an industrial temperature range of 0°C to 100°C and comes in a compact 1156-ball FCBGA package (35x35mm), ensuring reliability in harsh environments.
Why Choose This RFSoC?
The XCZU47DR-1FSVE1156E delivers unmatched integration for RF applications, combining processing power, programmable logic, and RF data conversion in a single chip. This integration reduces system cost, board space, and power consumption while improving signal integrity and system performance. Backed by AMD's comprehensive development tools and long-term product availability commitment, this RFSoC is the ideal choice for your next-generation wireless, aerospace, or defense application.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ RFSoC |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| ROHS |

XCZU47DR-1FSVE1156E.pdf