AMD XCZU47DR-1FSVG1517I

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AMD XCZU47DR-1FSVG1517I - Zynq® UltraScale+™ RFSoC FPGA

The AMD XCZU47DR-1FSVG1517I is a high-performance Zynq® UltraScale+™ RFSoC (Radio Frequency System-on-Chip) featuring over 930,000 logic cells, making it ideal for demanding aerospace, telecommunications, automotive, and industrial applications requiring advanced signal processing and programmable logic capabilities.

Key Features & Benefits

  • Dual Processing Subsystem: Quad ARM® Cortex®-A53 MPCore™ (1.2GHz) + Dual ARM® Cortex™-R5 (500MHz) for real-time control and application processing
  • Massive Logic Capacity: 930K+ logic cells provide extensive FPGA resources for complex designs
  • Rich Connectivity: Integrated CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces
  • Industrial Temperature Range: -40°C to +100°C (TJ) for harsh environment deployment
  • Advanced Packaging: 1517-FCBGA (40x40mm) for high-density integration
  • 256KB On-Chip RAM: Fast embedded memory for data buffering and processing

Ideal Applications

This RFSoC is engineered for software-defined radio (SDR), 5G wireless infrastructure, radar systems, test & measurement equipment, aerospace avionics, and high-performance embedded computing platforms requiring integrated RF data converters and programmable logic.

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Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ RFSoC
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)
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