AMD XCZU47DR-L1FFVE1156I
Regular price
Dhs. 79,241.77
Regular price
Dhs. 83,412.40
Sale price
Dhs. 79,241.77
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 79,241.77 | Dhs. 79,241.77 |
| 15+ | Dhs. 76,739.41 | Dhs. 1,151,091.15 |
| 25+ | Dhs. 75,071.16 | Dhs. 1,876,779.00 |
| 50+ | Dhs. 70,900.54 | Dhs. 3,545,027.00 |
| 100+ | Dhs. 62,559.30 | Dhs. 6,255,930.00 |
| N+ | Dhs. 12,511.86 | Price Inquiry |
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AMD Zynq UltraScale+ RFSoC XCZU47DR-L1FFVE1156I
The XCZU47DR-L1FFVE1156I is a high-performance System-on-Chip (SoC) from AMD's Zynq UltraScale+ RFSoC family, combining advanced FPGA fabric with integrated RF data converters and powerful ARM processing cores. Designed for demanding applications in wireless communications, aerospace, defense, and test & measurement systems.
Key Features
- 930K+ Logic Cells - Massive programmable logic capacity for complex signal processing and custom acceleration
- Quad ARM Cortex-A53 MPCore with CoreSight - High-performance 1.2GHz application processors for embedded Linux and real-time OS
- Dual ARM Cortex-R5 with CoreSight - 500MHz real-time processors for deterministic control and safety-critical functions
- 256KB On-Chip RAM - Fast memory for low-latency data processing
- Industrial Temperature Range - Operates reliably from -40°C to 100°C (junction temperature)
- Rich Connectivity - CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART, MMC/SD/SDIO interfaces
- 1156-FCBGA Package - 35mm x 35mm fine-pitch BGA for high-density designs
- RoHS Compliant - Meets environmental standards for lead-free manufacturing
Applications
Ideal for 5G wireless infrastructure, software-defined radio (SDR), radar systems, electronic warfare, satellite communications, medical imaging, and high-speed data acquisition systems requiring integrated RF signal processing and programmable logic.
Documentation: Full datasheets, reference designs, and technical documentation available from AMD.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ RFSoC |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| ROHS |  |
XCZU47DR-L1FFVE1156I.pdf
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