AMD XCZU4CG-1FBVB900I

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AMD Zynq UltraScale+ MPSoC XCZU4CG-1FBVB900I

The XCZU4CG-1FBVB900I is a high-performance System-on-Chip (SoC) combining dual ARM® Cortex®-A53 MPCore™ and dual ARM® Cortex™-R5 processors with advanced FPGA fabric featuring 192K+ logic cells. Engineered for mission-critical applications in aerospace, automotive, industrial automation, and telecom infrastructure.

Key Features

  • Dual-core ARM Cortex-A53 at 1.2GHz with CoreSight™ debug
  • Dual-core ARM Cortex-R5 at 500MHz for real-time processing
  • 192K+ logic cells Zynq UltraScale+ FPGA fabric
  • 256KB on-chip RAM for high-speed data processing
  • Industrial temperature range: -40°C to 100°C (TJ)
  • Rich connectivity: CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART
  • 900-FCBGA package (31x31mm) for high-density designs
  • RoHS compliant - environmentally responsible

Applications

Ideal for advanced embedded systems requiring heterogeneous processing, including ADAS automotive systems, industrial vision, 5G wireless infrastructure, aerospace avionics, medical imaging, and high-performance edge computing.

Documentation: Full datasheets and technical reference manuals available from AMD.

Availability: Active part status with long-term supply commitment for industrial and aerospace applications.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC CG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY