AMD XCZU4CG-2FBVB900I

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AMD Zynq® UltraScale+™ MPSoC CG - XCZU4CG-2FBVB900I

The XCZU4CG-2FBVB900I is a high-performance System-on-Chip (SoC) combining dual ARM® Cortex®-A53 MPCore™ and dual ARM® Cortex™-R5 processors with Zynq® UltraScale+™ FPGA fabric featuring 192K+ logic cells. Engineered for mission-critical applications in aerospace, automotive, industrial, medical, and telecommunications sectors.

Key Features

  • Dual-core ARM Cortex-A53 (1.3GHz) + Dual-core ARM Cortex-R5 (533MHz) with CoreSight™ debug
  • 192K+ logic cells FPGA fabric for custom acceleration and I/O flexibility
  • 256KB on-chip RAM for low-latency processing
  • Extended temperature range: -40°C to +100°C (TJ) for harsh environments
  • Rich connectivity: CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART, MMC/SD/SDIO
  • 900-FCBGA (31x31mm) package with advanced thermal management
  • RoHS compliant for global regulatory compliance

Applications

Ideal for advanced driver assistance systems (ADAS), industrial automation, medical imaging, 5G infrastructure, aerospace avionics, and high-reliability embedded systems requiring deterministic real-time processing combined with FPGA programmability.

Complete Specifications

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC CG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY