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XCZU4CG-2FBVB900I
Regular price
Dhs. 7,527.64
Regular price
Dhs. 7,923.83
Sale price
Dhs. 7,527.64
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 7,527.64 AED | Dhs. 7,527.64 AED |
| 15+ | Dhs. 7,289.92 AED | Dhs. 109,348.80 AED |
| 25+ | Dhs. 7,131.45 AED | Dhs. 178,286.25 AED |
| 50+ | Dhs. 6,735.26 AED | Dhs. 336,763.00 AED |
| 100+ | Dhs. 5,942.87 AED | Dhs. 594,287.00 AED |
| N+ | Dhs. 1,188.57 AED | Price Inquiry |
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Recycling Electronic Components
AMD Zynq® UltraScale+™ MPSoC CG - XCZU4CG-2FBVB900I
The XCZU4CG-2FBVB900I is a high-performance System-on-Chip (SoC) combining dual ARM® Cortex®-A53 MPCore™ and dual ARM® Cortex™-R5 processors with Zynq® UltraScale+™ FPGA fabric featuring 192K+ logic cells. Engineered for mission-critical applications in aerospace, automotive, industrial, medical, and telecommunications sectors.
Key Features
- Dual-core ARM Cortex-A53 (1.3GHz) + Dual-core ARM Cortex-R5 (533MHz) with CoreSight™ debug
- 192K+ logic cells FPGA fabric for custom acceleration and I/O flexibility
- 256KB on-chip RAM for low-latency processing
- Extended temperature range: -40°C to +100°C (TJ) for harsh environments
- Rich connectivity: CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART, MMC/SD/SDIO
- 900-FCBGA (31x31mm) package with advanced thermal management
- RoHS compliant for global regulatory compliance
Applications
Ideal for advanced driver assistance systems (ADAS), industrial automation, medical imaging, 5G infrastructure, aerospace avionics, and high-reliability embedded systems requiring deterministic real-time processing combined with FPGA programmability.
Complete Specifications
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC CG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| ROHS |  |
XCZU4CG-2FBVB900I.pdf
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