AMD XCZU4CG-L1FBVB900I
Regular price
Dhs. 6,588.70
Regular price
Dhs. 6,935.46
Sale price
Dhs. 6,588.70
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 6,588.70 | Dhs. 6,588.70 |
| 15+ | Dhs. 6,380.62 | Dhs. 95,709.30 |
| 25+ | Dhs. 6,241.91 | Dhs. 156,047.75 |
| 50+ | Dhs. 5,895.14 | Dhs. 294,757.00 |
| 100+ | Dhs. 5,201.60 | Dhs. 520,160.00 |
| N+ | Dhs. 1,040.32 | Price Inquiry |
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AMD Zynq UltraScale+ MPSoC CG Series - XCZU4CG-L1FBVB900I
The XCZU4CG-L1FBVB900I is a high-performance System-on-Chip (SoC) from AMD's Zynq UltraScale+ MPSoC CG family, combining programmable logic with processing power for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features & Benefits
- Dual Processing Architecture: Integrates dual ARM Cortex-A53 MPCore (1.2GHz) and dual ARM Cortex-R5 (500MHz) processors with CoreSight debug technology for real-time and application processing
- Extensive FPGA Resources: 192K+ logic cells provide flexible, reconfigurable hardware acceleration for custom algorithms and signal processing
- Rich Connectivity: Built-in CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces eliminate need for external controllers
- Industrial-Grade Reliability: Extended operating temperature range (-40°C to 100°C TJ) ensures stable performance in harsh environments
- Memory & Peripherals: 256KB on-chip RAM, DMA, and watchdog timer support complex embedded applications
- Compact Form Factor: 900-ball FCBGA package (31x31mm) optimizes board space while delivering high I/O density
- RoHS Compliant: Meets environmental standards for global deployment
Ideal Applications
This versatile MPSoC excels in applications requiring both processing power and FPGA flexibility: advanced driver assistance systems (ADAS), industrial machine vision, 5G wireless infrastructure, medical imaging equipment, aerospace avionics, and high-performance embedded computing platforms.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC CG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| ROHS |  |
XCZU4CG-L1FBVB900I.pdf
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