AMD XCZU4EG-1FBVB900I

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AMD Zynq UltraScale+ MPSoC EG - XCZU4EG-1FBVB900I

The XCZU4EG-1FBVB900I is a high-performance System-on-Chip (SoC) combining ARM processing power with FPGA programmability, ideal for aerospace, automotive, industrial automation, and telecom infrastructure applications.

Key Features

  • Quad-core ARM Cortex-A53 MPCore with CoreSight (1.2GHz) plus Dual ARM Cortex-R5 real-time processors
  • 192K+ logic cells FPGA fabric for custom hardware acceleration
  • ARM Mali-400 MP2 GPU for graphics processing
  • 256KB on-chip RAM with extensive connectivity options
  • Industrial temperature range: -40°C to 100°C (TJ)
  • RoHS compliant - environmentally responsible design
  • 900-FCBGA (31x31mm) package for high-density integration

Connectivity & Peripherals

Comprehensive I/O support including CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART/USART, MMC/SD/SDIO, plus DMA and watchdog timer peripherals.

Applications

Perfect for embedded vision systems, motor control, software-defined radio, 5G infrastructure, ADAS automotive systems, and mission-critical industrial control where deterministic real-time processing meets FPGA flexibility.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC EG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.