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AMD

XCZU4EG-L2FBVB900E

Regular price Dhs. 8,533.12
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Recycling Electronic Components

AMD Zynq® UltraScale+™ MPSoC EG - XCZU4EG-L2FBVB900E

The XCZU4EG-L2FBVB900E is a high-performance System-on-Chip (SoC) combining FPGA fabric with embedded processing, designed for mission-critical applications in aerospace, automotive, industrial automation, and telecommunications infrastructure.

Key Features

  • Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ for application processing
  • Dual ARM® Cortex™-R5 with CoreSight™ for real-time control
  • ARM Mali™-400 MP2 graphics processing unit
  • 192K+ Logic Cells for flexible FPGA implementation
  • 256KB RAM on-chip memory
  • Multi-speed operation: 533MHz, 600MHz, 1.3GHz

Connectivity & Peripherals

Comprehensive I/O support including CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, plus DMA and watchdog timer peripherals for robust system integration.

Industrial-Grade Reliability

Operating temperature range of 0°C to 100°C (TJ), 900-FCBGA (31x31mm) package, and full RoHS compliance ensure long-term availability and regulatory adherence for production deployments.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC EG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.

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