AMD XCZU55DR-L2FFVE1156I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 84,792.35 | Dhs. 84,792.35 |
| 15+ | Dhs. 82,114.69 | Dhs. 1,231,720.35 |
| 25+ | Dhs. 80,329.59 | Dhs. 2,008,239.75 |
| 50+ | Dhs. 75,866.84 | Dhs. 3,793,342.00 |
| 100+ | Dhs. 66,941.33 | Dhs. 6,694,133.00 |
| N+ | Dhs. 13,388.27 | Price Inquiry |
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AMD Zynq® UltraScale+™ RFSoC DR - XCZU55DR-L2FFVE1156I
High-performance System-on-Chip (SoC) combining multi-core ARM processing with FPGA fabric, designed for demanding RF and signal processing applications in industrial, automotive, aerospace, and communications sectors.
Key Features
- Dual Processing Architecture: Quad ARM® Cortex®-A53 MPCore™ (1.3GHz) + Dual ARM® Cortex™-R5 with CoreSight™ (533MHz)
- Advanced Connectivity: PCIe, Ethernet, USB OTG, CANbus, I2C, SPI, UART/USART, MMC/SD/SDIO
- Industrial Grade: -40°C to 100°C junction temperature range
- Compact Package: 1156-FCBGA (35x35mm)
- RoHS Compliant: Environmentally friendly, lead-free manufacturing
Applications: Wireless infrastructure, test & measurement, aerospace & defense, software-defined radio, radar systems, 5G communications, edge computing.
Documentation: Full datasheets, reference designs, and technical support available from AMD.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ RFSoC DR |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.3GHz |
| Primary Attributes | Zynq® UltraScale+™ RFSoC |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| ROHS |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
