AMD XCZU55DR-L2FFVE1156I

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AMD Zynq® UltraScale+™ RFSoC DR - XCZU55DR-L2FFVE1156I

High-performance System-on-Chip (SoC) combining multi-core ARM processing with FPGA fabric, designed for demanding RF and signal processing applications in industrial, automotive, aerospace, and communications sectors.

Key Features

  • Dual Processing Architecture: Quad ARM® Cortex®-A53 MPCore™ (1.3GHz) + Dual ARM® Cortex™-R5 with CoreSight™ (533MHz)
  • Advanced Connectivity: PCIe, Ethernet, USB OTG, CANbus, I2C, SPI, UART/USART, MMC/SD/SDIO
  • Industrial Grade: -40°C to 100°C junction temperature range
  • Compact Package: 1156-FCBGA (35x35mm)
  • RoHS Compliant: Environmentally friendly, lead-free manufacturing

Applications: Wireless infrastructure, test & measurement, aerospace & defense, software-defined radio, radar systems, 5G communications, edge computing.

Documentation: Full datasheets, reference designs, and technical support available from AMD.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ RFSoC DR
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq® UltraScale+™ RFSoC
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.