AMD XCZU57DR-2FFVE1156I

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AMD Zynq UltraScale+ RFSoC XCZU57DR-2FFVE1156I

High-performance System-on-Chip (SoC) combining programmable logic with integrated RF data converters, designed for advanced wireless communications, aerospace, and industrial applications requiring real-time signal processing capabilities.

Key Features

  • Quad ARM Cortex-A53 MPCore with CoreSight and Dual ARM Cortex-R5 processors
  • Integrated RF data converters for direct RF sampling architectures
  • 1156-FCBGA (35x35mm) package for high-density designs
  • Industrial temperature range: -40°C to 100°C (TJ)
  • Comprehensive connectivity: PCIe, Ethernet, USB OTG, CANbus, DDR, DMA
  • Active production status with full AMD documentation support
  • RoHS compliant for global regulatory requirements

Applications

Ideal for 5G wireless infrastructure, phased array radar systems, test and measurement equipment, software-defined radio platforms, and mission-critical aerospace systems requiring deterministic processing and high-speed data conversion.

Documentation & Support

Full AMD technical documentation, datasheets, and design resources available. Contact us for volume pricing, lead times, and application engineering support.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ RFSoC DR
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq® UltraScale+™ RFSoC
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.