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XCZU5CG-L2FBVB900E
Regular price
Dhs. 11,918.75
Regular price
Dhs. 12,546.06
Sale price
Dhs. 11,918.75
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 11,918.75 AED | Dhs. 11,918.75 AED |
| 15+ | Dhs. 11,542.38 AED | Dhs. 173,135.70 AED |
| 25+ | Dhs. 11,291.45 AED | Dhs. 282,286.25 AED |
| 50+ | Dhs. 10,664.15 AED | Dhs. 533,207.50 AED |
| 100+ | Dhs. 9,409.55 AED | Dhs. 940,955.00 AED |
| N+ | Dhs. 1,881.91 AED | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC CG - XCZU5CG-L2FBVB900E
The AMD XCZU5CG-L2FBVB900E is a high-performance System-on-Chip (SoC) combining programmable logic with processing power, designed for mission-critical applications in aerospace, automotive, industrial control, medical devices, and telecommunications.
Key Features & Benefits
- Dual-Core Processing: Dual ARM® Cortex®-A53 MPCore™ (1.3GHz) and Dual ARM® Cortex™-R5 (533MHz) with CoreSight™ for real-time processing and advanced debugging
- High-Density FPGA: 256K+ logic cells provide exceptional flexibility for custom hardware acceleration and signal processing
- Rich Connectivity: Integrated CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO interfaces eliminate the need for external controllers
- Industrial-Grade Reliability: Operating temperature range of 0°C to 100°C (TJ) ensures stable performance in demanding environments
- Compact 900-FCBGA Package: 31x31mm footprint optimizes board space while maintaining high I/O density
- RoHS Compliant: Meets environmental standards for global deployment
Ideal Applications
This versatile MPSoC excels in applications requiring both processing power and programmable logic, including industrial automation, motor control, vision systems, software-defined radio, edge computing, and embedded AI/ML inference.
Authorized Distributor: Full traceability, RoHS/REACH compliance, and long lifecycle support for critical designs. Contact us for volume pricing, custom packaging options, and technical support.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC CG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| ROHS |  |
XCZU5CG-L2FBVB900E.pdf
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