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AMD

XCZU5EG-1FBVB900I

Regular price Dhs. 10,214.81
Regular price Dhs. 10,752.43 Sale price Dhs. 10,214.81
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Recycling Electronic Components

AMD Zynq® UltraScale+™ MPSoC EG - XCZU5EG-1FBVB900I

The XCZU5EG-1FBVB900I is a high-performance System-on-Chip (SoC) combining FPGA programmable logic with ARM processing cores, designed for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.

Key Features

  • Multi-Core Processing: Quad ARM® Cortex®-A53 MPCore™ (up to 1.2GHz) + Dual ARM® Cortex™-R5 for real-time control
  • Advanced Graphics: ARM Mali™-400 MP2 GPU for embedded visualization
  • Massive Logic Capacity: 256K+ logic cells for complex FPGA designs
  • Comprehensive Connectivity: Ethernet, USB OTG, CANbus, SPI, I2C, UART, MMC/SD/SDIO
  • Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environments
  • Compact Package: 900-FCBGA (31x31mm) for space-constrained designs
  • RoHS Compliant: Environmentally friendly, lead-free manufacturing

Ideal Applications

Perfect for edge computing, industrial IoT gateways, motor control systems, medical imaging equipment, avionics, automotive ADAS, and high-reliability embedded systems requiring long lifecycle support.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC EG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.

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