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XCZU5EG-L1FBVB900I

Regular price Dhs. 11,438.26
Regular price Dhs. 12,040.28 Sale price Dhs. 11,438.26
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Recycling Electronic Components

AMD Zynq® UltraScale+™ MPSoC EG - XCZU5EG-L1FBVB900I

The XCZU5EG-L1FBVB900I is a high-performance System-on-Chip (SoC) combining ARM processing subsystems with FPGA programmable logic, engineered for demanding aerospace, automotive, industrial automation, and telecommunications applications requiring real-time processing, adaptive hardware acceleration, and long-term availability.

Key Features & Benefits

  • Heterogeneous Processing Architecture: Quad-core ARM® Cortex®-A53 MPCore™ (up to 1.2 GHz) for application processing, dual ARM® Cortex™-R5 (up to 600 MHz) for real-time control, and ARM Mali™-400 MP2 GPU for graphics acceleration
  • High-Density FPGA Fabric: 256K+ logic cells with programmable logic for custom hardware acceleration, signal processing, and protocol implementation
  • Industrial Temperature Range: Qualified for -40°C to +100°C (TJ) operation, suitable for harsh-environment deployments
  • Rich Connectivity: Integrated CANbus, Gigabit Ethernet, USB OTG, PCIe, multiple UART/SPI/I²C interfaces, and MMC/SD/SDIO support
  • On-Chip Memory: 256 KB on-chip RAM with DMA and watchdog timer peripherals
  • Compact 900-FCBGA Package: 31×31 mm footprint optimized for space-constrained designs
  • RoHS Compliant: Meets environmental and regulatory standards for global deployment

Typical Applications

Ideal for aerospace avionics, automotive ADAS and gateway systems, industrial machine vision and motion control, 5G wireless infrastructure, medical imaging, and defense embedded systems requiring deterministic real-time performance with adaptive hardware acceleration.

Sourcing & Support

Sourced exclusively from authorized AMD distributors with full traceability, manufacturer documentation, and long-lifecycle support. Every unit ships with certificate of conformance and RoHS declaration.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC EG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.

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