AMD XCZU5EV-1FBVB900I

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AMD Zynq® UltraScale+™ MPSoC EV XCZU5EV-1FBVB900I

The XCZU5EV-1FBVB900I is a high-performance System-on-Chip (SoC) combining ARM processing cores with FPGA fabric, designed for demanding aerospace, automotive, industrial automation, and telecom infrastructure applications.

Key Features

  • Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ for application processing
  • Dual ARM® Cortex™-R5 with CoreSight™ for real-time control
  • ARM Mali™-400 MP2 graphics processing unit
  • 256K+ logic cells FPGA fabric for custom acceleration
  • 256KB RAM on-chip memory
  • Industrial temperature range: -40°C to 100°C (TJ)
  • RoHS compliant for environmental standards

Connectivity & Peripherals

Comprehensive I/O support including CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, plus DMA and watchdog timer peripherals for robust system integration.

Performance Specifications

Multi-speed operation at 500MHz, 600MHz, and 1.2GHz enables flexible power/performance optimization for your application requirements.

Package & Availability

Supplied in 900-FCBGA (31x31mm) package, tray packaging. Active part status ensures long-term availability for production designs.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC EV
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.