XCZU5EV-2FBVB900I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 14,152.14 AED | Dhs. 14,152.14 AED |
| 15+ | Dhs. 13,705.22 AED | Dhs. 205,578.30 AED |
| 25+ | Dhs. 13,407.28 AED | Dhs. 335,182.00 AED |
| 50+ | Dhs. 12,662.43 AED | Dhs. 633,121.50 AED |
| 100+ | Dhs. 11,172.74 AED | Dhs. 1,117,274.00 AED |
| N+ | Dhs. 2,234.55 AED | Price Inquiry |
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AMD XCZU5EV-2FBVB900I - Zynq® UltraScale+™ MPSoC EV Device
The XCZU5EV-2FBVB900I is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC EV family, combining advanced processing capabilities with FPGA flexibility for demanding embedded applications in aerospace, automotive, industrial, medical, and telecom sectors.
Key Features & Benefits
- Heterogeneous Multi-Core Processing: Quad ARM® Cortex®-A53 MPCore™ (1.3GHz) + Dual ARM® Cortex™-R5 (600MHz) + ARM Mali™-400 MP2 GPU for real-time control and graphics acceleration
- High-Density FPGA Fabric: 256K+ logic cells for custom hardware acceleration and signal processing
- Rich Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO for versatile system integration
- Industrial-Grade Reliability: -40°C to 100°C operating temperature, RoHS/REACH compliant
- Compact 900-FCBGA Package: 31x31mm form factor for space-constrained designs
- 256KB On-Chip RAM: Low-latency memory for critical real-time tasks
Ideal Applications
This device excels in advanced driver assistance systems (ADAS), industrial automation, medical imaging, 5G wireless infrastructure, aerospace avionics, and vision-guided robotics where heterogeneous processing, hardware acceleration, and long-term availability are essential.
Authorized Distribution & Support
We are an authorized distributor providing 100% traceable, genuine AMD components with full manufacturer documentation, lifecycle support, and compliance certification. Every unit ships with original packaging and quality assurance.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EV |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| ROHS |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
