AMD XCZU65DR-1FSVE1156I

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AMD XCZU65DR-1FSVE1156I - Zynq® UltraScale+™ RFSoC FPGA

The XCZU65DR-1FSVE1156I is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ RFSoC family, combining advanced FPGA fabric with integrated RF data converters and powerful ARM® processing cores. This device is engineered for demanding applications in aerospace, defense, wireless communications, test & measurement, and software-defined radio systems requiring exceptional signal processing capabilities and long-term availability.

Key Features & Benefits

  • Heterogeneous Processing Architecture: Quad ARM® Cortex®-A53 MPCore™ (1.2GHz) with CoreSight™ for application processing, plus Dual ARM® Cortex™-R5 (500MHz) with CoreSight™ for real-time control
  • Integrated RF Data Converters: RFSoC technology eliminates external ADC/DAC components, reducing board complexity, power consumption, and BOM cost
  • 256KB On-Chip RAM: High-speed embedded memory for critical data buffering and processing tasks
  • Industrial Temperature Range: -40°C to +100°C (TJ) operation ensures reliability in harsh environments
  • 1156-FCBGA Package: 35x35mm FCBGA footprint optimized for high-density designs with excellent thermal performance
  • Active Product Status: Long lifecycle commitment from AMD ensures multi-year design-in security and supply continuity
  • RoHS & REACH Compliant: Meets global environmental and regulatory standards for worldwide deployment

Target Applications

  • 5G/6G Wireless Infrastructure & Massive MIMO
  • Phased Array Radar & Electronic Warfare Systems
  • Software-Defined Radio (SDR) Platforms
  • High-Speed Test & Measurement Equipment
  • Aerospace & Defense Signal Processing
  • Medical Imaging & Ultrasound Systems
  • Satellite Communications & Ground Stations

Why Choose Our Distribution

As an authorized distributor, we provide 100% traceable, factory-sealed components with full manufacturer documentation, certificates of conformance, and lifecycle support. Every unit ships with RoHS/REACH compliance certification and is backed by our quality assurance program.

Need technical support or volume pricing? Contact our applications engineering team for design-in assistance, reference designs, and custom packaging options.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ RFSoC
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals -
Connectivity -
Speed 500MHz, 1.2GHz
Primary Attributes Zynq® UltraScale+™ RFSoC
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.