AMD XCZU6CG-1FFVC900I

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AMD Zynq® UltraScale+™ MPSoC CG - XCZU6CG-1FFVC900I

The XCZU6CG-1FFVC900I is a high-performance System-on-Chip (SoC) combining dual ARM® Cortex®-A53 MPCore™ and dual ARM® Cortex™-R5 processors with 469K+ logic cell FPGA fabric. Engineered for mission-critical applications in aerospace, automotive, industrial automation, and telecom infrastructure.

Key Features

  • Dual-core ARM Cortex-A53 (1.2GHz) + Dual-core ARM Cortex-R5 (500MHz) processing system
  • 469,000+ logic cells for complex FPGA implementations
  • 256KB on-chip RAM for low-latency data processing
  • Industrial temperature range: -40°C to +100°C (TJ)
  • Rich connectivity: CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART, MMC/SD/SDIO
  • 900-FCBGA (31x31mm) package for high-density designs
  • RoHS compliant - meets environmental standards
  • Active production status - long-term availability guaranteed

Applications

Ideal for embedded vision systems, motor control, software-defined radio, 5G infrastructure, ADAS automotive systems, industrial IoT gateways, and real-time signal processing.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC CG
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY