-
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XCZU6CG-1FFVC900I
Regular price
Dhs. 10,557.39
Regular price
Dhs. 11,113.03
Sale price
Dhs. 10,557.39
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 10,557.39 AED | Dhs. 10,557.39 AED |
| 15+ | Dhs. 10,223.99 AED | Dhs. 153,359.85 AED |
| 25+ | Dhs. 10,001.73 AED | Dhs. 250,043.25 AED |
| 50+ | Dhs. 9,446.08 AED | Dhs. 472,304.00 AED |
| 100+ | Dhs. 8,334.77 AED | Dhs. 833,477.00 AED |
| N+ | Dhs. 1,666.95 AED | Price Inquiry |
Shipping calculated at checkout.
Quantity
Couldn't load pickup availability
Recycling Electronic Components
AMD Zynq® UltraScale+™ MPSoC CG - XCZU6CG-1FFVC900I
The XCZU6CG-1FFVC900I is a high-performance System-on-Chip (SoC) combining dual ARM® Cortex®-A53 MPCore™ and dual ARM® Cortex™-R5 processors with 469K+ logic cell FPGA fabric. Engineered for mission-critical applications in aerospace, automotive, industrial automation, and telecom infrastructure.
Key Features
- Dual-core ARM Cortex-A53 (1.2GHz) + Dual-core ARM Cortex-R5 (500MHz) processing system
- 469,000+ logic cells for complex FPGA implementations
- 256KB on-chip RAM for low-latency data processing
- Industrial temperature range: -40°C to +100°C (TJ)
- Rich connectivity: CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART, MMC/SD/SDIO
- 900-FCBGA (31x31mm) package for high-density designs
- RoHS compliant - meets environmental standards
- Active production status - long-term availability guaranteed
Applications
Ideal for embedded vision systems, motor control, software-defined radio, 5G infrastructure, ADAS automotive systems, industrial IoT gateways, and real-time signal processing.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC CG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| ROHS |  |
XCZU6CG-1FFVC900I.pdf
×