AMD XCZU6EG-1FFVB1156I

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Regular price Dhs. 12,906.01
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The AMD XCZU6EG-1FFVB1156I is a high-performance Zynq® UltraScale+™ MPSoC EG device combining programmable logic with embedded processing for demanding industrial, automotive, aerospace, and communications applications.

Key Features:

  • Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ processing system
  • Dual ARM® Cortex™-R5 real-time processors with CoreSight™
  • ARM Mali™-400 MP2 graphics processing unit
  • 469K+ programmable logic cells for custom acceleration
  • 256KB on-chip RAM for high-speed data processing
  • Multi-speed operation: 500MHz, 600MHz, 1.2GHz
  • Industrial temperature range: -40°C to 100°C (TJ)
  • Comprehensive connectivity: Ethernet, USB OTG, CANbus, SPI, I2C, UART/USART, MMC/SD/SDIO
  • 1156-FCBGA (35x35mm) package for space-efficient designs

Applications: Embedded vision, motor control, industrial automation, automotive ADAS, aerospace systems, 5G wireless infrastructure, edge computing, and AI/ML acceleration.

Complete Technical Specifications:

Backed by AMD's comprehensive documentation and long-term availability commitment. RoHS compliant. Authentic components with full traceability.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC EG
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.