AMD XCZU6EG-L1FFVC900I

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AMD Zynq® UltraScale+™ MPSoC EG XCZU6EG-L1FFVC900I

The XCZU6EG-L1FFVC900I is a high-performance system-on-chip (SoC) combining programmable logic with ARM processing cores, designed for demanding embedded applications in industrial, automotive, aerospace, and communications sectors.

Key Features

  • Heterogeneous Processing: Quad ARM Cortex-A53 MPCore (1.2GHz) + Dual ARM Cortex-R5 + ARM Mali-400 MP2 GPU
  • Programmable Logic: 469K+ logic cells with Zynq UltraScale+ FPGA architecture
  • Memory: 256KB integrated RAM
  • Connectivity: CANbus, Ethernet, USB OTG, I2C, SPI, UART, MMC/SD/SDIO, EBI/EMI
  • Industrial Grade: -40°C to 100°C junction temperature range
  • Package: 900-pin FCBGA (31x31mm), tray packaging

Applications

Ideal for edge computing, industrial automation, automotive ADAS, aerospace systems, 5G infrastructure, video processing, and high-performance embedded applications requiring both real-time processing and FPGA acceleration.

Complete Specifications

Documentation: Full technical specifications, datasheets, and design resources available from AMD.

Product attributes Property Value
Manufacturer AMD
Product Series Zynq® UltraScale+™ MPSoC EG
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.