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XCZU7CG-1FFVF1517I
Regular price
Dhs. 13,376.26
Regular price
Dhs. 14,080.28
Sale price
Dhs. 13,376.26
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 13,376.26 AED | Dhs. 13,376.26 AED |
| 15+ | Dhs. 12,953.86 AED | Dhs. 194,307.90 AED |
| 25+ | Dhs. 12,672.25 AED | Dhs. 316,806.25 AED |
| 50+ | Dhs. 11,968.24 AED | Dhs. 598,412.00 AED |
| 100+ | Dhs. 10,560.21 AED | Dhs. 1,056,021.00 AED |
| N+ | Dhs. 2,112.04 AED | Price Inquiry |
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Recycling Electronic Components
AMD Zynq® UltraScale+™ MPSoC CG - XCZU7CG-1FFVF1517I
The XCZU7CG-1FFVF1517I is a high-performance System-on-Chip (SoC) combining FPGA programmable logic with dual ARM® Cortex®-A53 and dual ARM® Cortex®-R5 processors. Engineered for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications, this device delivers exceptional processing power and flexibility.
Key Features
- 504K+ Logic Cells - Extensive FPGA fabric for complex digital designs
- Dual-Core ARM Cortex-A53 MPCore™ (1.2GHz) - High-performance application processing with CoreSight™ debug
- Dual-Core ARM Cortex-R5 (500MHz) - Real-time processing for deterministic control applications
- 256KB On-Chip RAM - Fast access memory for critical operations
- Rich Connectivity - CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI interfaces
- Industrial Temperature Range - Qualified for -40°C to +100°C (TJ) operation
- Advanced Packaging - 1517-FCBGA (40x40mm) for high I/O density and thermal performance
- RoHS Compliant - Meets environmental standards for global deployment
Applications
Ideal for advanced embedded systems requiring heterogeneous processing, including software-defined radio, motor control, vision systems, industrial IoT gateways, medical imaging, and safety-critical automotive applications.
Authorized Distributor - Full traceability, genuine AMD components, long lifecycle support for critical designs.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC CG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40) |
| ROHS |  |
XCZU7CG-1FFVF1517I.pdf
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