XCZU7EG-1FBVB900I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 12,359.22 AED | Dhs. 12,359.22 AED |
| 15+ | Dhs. 11,968.91 AED | Dhs. 179,533.65 AED |
| 25+ | Dhs. 11,708.72 AED | Dhs. 292,718.00 AED |
| 50+ | Dhs. 11,058.24 AED | Dhs. 552,912.00 AED |
| 100+ | Dhs. 9,757.27 AED | Dhs. 975,727.00 AED |
| N+ | Dhs. 1,951.45 AED | Price Inquiry |
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AMD XCZU7EG-1FBVB900I Zynq UltraScale+ MPSoC EG - High-Performance System-on-Chip for Industrial, Aerospace & Automotive Applications
Authorized distributor stock available. The AMD XCZU7EG-1FBVB900I is a high-performance heterogeneous system-on-chip (SoC) combining a quad-core ARM Cortex-A53 MPCore processing system with 504K+ logic cell FPGA fabric, designed for demanding industrial automation, automotive ADAS, aerospace systems, and 5G wireless infrastructure applications requiring custom acceleration and extensive I/O connectivity.
Key Features & Benefits
- Heterogeneous Processing: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 GPU for parallel workload optimization
- Programmable Logic: 504K+ logic cells FPGA fabric enables custom hardware acceleration, protocol implementation, and flexible I/O expansion
- On-Chip Memory: 256KB on-chip RAM with extensive connectivity options including CANbus, Ethernet, USB OTG, PCIe, and more
- Industrial Temperature Range: -40°C to 100°C (TJ) for harsh environment deployment in automotive, aerospace, and industrial control systems
- High-Density Integration: 900-pin FCBGA package (31x31mm) optimized for space-constrained embedded designs
- Compliance & Availability: RoHS compliant, active production status with authorized distributor stock and full manufacturer documentation
Target Applications
The XCZU7EG-1FBVB900I is ideal for:
- Embedded Vision Systems: Real-time image processing with hardware-accelerated computer vision algorithms
- Industrial Automation & Control: Deterministic motor control, multi-axis motion control, and PLC functionality
- Software-Defined Radio (SDR): Flexible baseband processing for 5G wireless infrastructure and communications equipment
- Automotive ADAS: Advanced driver assistance systems requiring sensor fusion and real-time decision making
- Aerospace & Defense: High-reliability embedded computing for avionics, radar, and signal intelligence applications
- Edge Computing & AI Inference: Heterogeneous processing for neural network acceleration at the edge
Why Choose Authorized Distribution?
Purchasing from an authorized distributor ensures authentic AMD components with full manufacturer warranty, complete technical documentation, and traceable supply chain for compliance-critical applications in aerospace, automotive, and industrial markets.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| ROHS |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
