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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XCZU7EG-1FFVC1156E
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 10,974.13 AED | Dhs. 10,974.13 AED |
| 15+ | Dhs. 10,627.59 AED | Dhs. 159,413.85 AED |
| 25+ | Dhs. 10,396.56 AED | Dhs. 259,914.00 AED |
| 50+ | Dhs. 9,818.97 AED | Dhs. 490,948.50 AED |
| 100+ | Dhs. 8,663.80 AED | Dhs. 866,380.00 AED |
| N+ | Dhs. 1,732.76 AED | Price Inquiry |
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AMD Zynq® UltraScale+™ MPSoC EG - XCZU7EG-1FFVC1156E
The AMD XCZU7EG-1FFVC1156E is a high-performance System-on-Chip (SoC) combining FPGA fabric with embedded processing, ideal for mission-critical applications in aerospace, automotive, industrial automation, medical devices, and telecommunications.
Key Features
- 504K+ Logic Cells - Extensive programmable logic for complex designs
- Quad ARM® Cortex®-A53 MPCore™ - High-performance 64-bit application processors with CoreSight™ debug
- Dual ARM® Cortex™-R5 - Real-time processing with CoreSight™ for deterministic control
- ARM Mali™-400 MP2 GPU - Graphics processing for HMI and visualization
- 256KB On-Chip RAM - Fast embedded memory for critical operations
- Multi-Speed Operation - 500MHz, 600MHz, and 1.2GHz clock domains
- Rich Connectivity - CANbus, Ethernet, USB OTG, PCIe, I2C, SPI, UART, MMC/SD/SDIO
- Industrial Temperature Range - 0°C to 100°C (TJ) for harsh environments
- 1156-FCBGA Package - 35x35mm fine-pitch BGA for high-density designs
- RoHS Compliant - Environmentally responsible manufacturing
Applications
This MPSoC is engineered for demanding embedded systems requiring both programmable logic and high-performance processing: aerospace flight control and avionics, automotive ADAS and autonomous driving, industrial machine vision and robotics, medical imaging and diagnostic equipment, 5G wireless infrastructure, and defense/security systems.
Why Choose AMD Zynq UltraScale+?
The Zynq UltraScale+ architecture delivers unmatched integration, combining FPGA adaptability with ARM processing power. This enables system architects to consolidate multiple discrete components, reduce board complexity, lower power consumption, and accelerate time-to-market while maintaining full traceability and long lifecycle support.
| Product attributes | Property Value |
| Manufacturer | AMD |
| Product Series | Zynq® UltraScale+™ MPSoC EG |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| ROHS |  |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
